Smart Communication Module-1

Time：2021/5/13 22:32:23
clicks：623

Key Specifications/Special Features:

Application Field: Intelligent navigation module
Layer Number: 8 Layer Board(2+4+2)
Thickness: 1.0mm
Trace Width/Space:3/3mil
Surface Treatment: ENIG+OSP

min drill bit 0.20mm
BGA pad size: 0.25mm