| Preferred Materials | |
| FR4 Standard Tg | Shengyi, ITEQ, KB, Nanya |
| FR4 Mid Tg (Lead Free Compatible) | Shengyi S1000, ITEQ IT158 |
|
FR4 High Tg (Lead Free Compatible) |
Shengyi S1000‐2, S1170 EMC EM827 Isola 370HR ITEQ IT180A Panasonic R1755V |
|
High Performance Low Loss FR4 |
EMC EM828, EM888(S), EM888(K) Isola FR408, FR408HR Isola I‐Speed, I‐Tera MT Nelco N4000‐13EP, EPSI Panasonic R5775 Megtron 6 |
| RF Materials |
Rogers RO4350, RO3010 Taconic RF‐30, RF‐35, TLC, TLX, TLY Taconic 601, 602, 603, 605 |
|
Halogen Free |
EMC EM285, EM370(D) Panasonic R1566 |
| Aluminum Backed PCB | Shengyi SAR20, Yugu YGA |
| Additional Materials |
| Rigid Polyimide: Shengyi SH260, Ventec VT901 |
| BT Epoxy: Nelco and Mitsubishi |
| High CTI FR4: Shengyi S1600 |
| Flexible Circuit Materials: Dupont, Panasonic, Taiflex, Shengyi |
| Surface Finishes | |
| Electroless Nickel Immersion Gold (ENIG) | |
| Hot Air Solder Level (HASL, Lead and Lead‐free) | |
| OSP, Immersion Tin,Immersion Silver, ENEPIG | |
| Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold | |
| Selective and Multiple Surface Finishes, Carbon Ink, Peelable SM | |
| PCB Technologies | Standard | Advanced |
| Rigid‐Flex & Flexible Circuits | Y | Y |
| Buried and Blind Vias | Y | Y |
| Sequential Lamination | Y | Y |
| Impedance Control | ± 10% | ± 5% |
| Hybrids & Mixed Dielectrics | Y | Y |
| Aluminum PCB's | Y | Y |
| Non‐Conductive Via Fill (VIP) | Y | Y |
| Conductive Via Fill | Y | Y |
| Cavity Boards | Y | Y |
| Backdrilling | Y | Y |
| Controlled Depth Drill and Rout | Y | Y |
| Edge Plating | Y | Y |
| Buried Capacitance | Y | Y |
| Etch Back | Y | Y |
| In‐board Beveling | Y | Y |
| 2‐D Bar Code Printing | Y | Y |